Batch-type plasma ashing device, wafer asher device
50-piece batch plasma ashing system (asher) compatible with 6-inch and 8-inch wafers. There is also a wafer single-piece processing type available.
We offer high-performance devices at low prices. Ashing rate: over 300 Å, in-plane uniformity: ±20% or less, inter-batch uniformity: ±20% or less, processing capacity: 150 wafers/hour (calculated at RF0 minutes). We also provide low-cost batch-type ashers and etchers. We accept retrofitting of aging equipment as well.
- Company：ヤマトマテリアル
- Price：Other
